Liquid Crystal Polymer(LCP) Resin

LCP-JN1350

Main Application: Compounding
Used for the modification of high-end materials

Quantity

Contact Now

add to cart

Liquid Crystal Polymer（LCP) is a thermoplastic engineering plastic that exhibits nematic liquid crystallinity when melted and belongs to the family of aromatic polyesters. It has a rigid and inflexible polymer structure and possesses unique and excellent properties compared to other thermoplastic plastics.

System Assurance

System Assurance

The fitures of the LCP Resin

LCP Resin LCP Polymer

main featuresmain features

SpecificationSpecification	Main features
High Melting Point	Melting point 250~385℃
High Strength	Tensile strength up to 170MPa
High heat resistance	Heat distortion temperature (1.8MPa) can reach 335℃
High toughness	Notched Izod impact strength can reach 190kJ/m²
Anti-static	Surface resistivity can reach 10⁸Ω
Low dielectric	Dielectric constant can reach a minimum of 2.5 and a maximum of 10 Dielectric loss can reach a minimum of 0.0012
High dielectric

Properties of Copolymen®(LCP Resin)

roperties		Units	Standard	Grade
roperties		Units	Standard	JA1280A	JT1330	JE1340	JL1340	JN1350	JH1370
Water absorption (23℃, 24hr)		%	ISO62	0.03	0.03	0.03	0.03	0.03	0.03
Density		g/cm³	ISO 1183	1.40	1.40	1.40	1.40	1.40	1.40
Tensile strength		MPa	ISO 527-2	120	135	110	110	115	95
Flexural strength		MPa	ISO 178	130	120	130	115	120	120
Flexural modulus		MPa	ISO 178	8000	7000	8500	7000	7500	12000
Izod unnotched impact strength		kJ/m²	ISO 180/1U	250	70	80	60	60	30
Izod notched impact strength		kJ/m²	ISO 180/1U	190	20	60	30	30	15
Temperature of deflection under Load(1.8MPa)	Resin	℃	ISO 75-1,2	175	185	225	180	250	285
Temperature of deflection under Load(1.8MPa)	GF30% modified	℃	ISO 75-1,2	170	270	280	275	280	310
Melting temperature		℃	ISO 11357-1/-3	280	330	340	340	350	370
Viscosity	Test temperature	℃	GB/T25278-2010	310	350	350	350	350	390
Viscosity	Shear rate, 1000s-1	pa.s	GB/T25278-2010	70	60	50	15	45	50
Melt flow index	Test temperature	℃	GB/T3682.2	310	340	350	350	350	390
Melt flow index	MVR	cm3/10min	GB/T3682.2	150	100	400	1000	500	400
Dielectric constant	1MHz		IEC 62631-2-1	3.1	3.3	3.4	3.4	3.4	3.4
Dissipation factor	1MHz		IEC 62631-2-1	0.02	0.02	0.02	0.02	0.02	0.02

Application areas of LCP resin

Electronics and electrical
Medical grade material
Industrial supplies
Aerospace materials

**1.Electronics and electrical**
Precision connector	SIM card holder	StylusStylus

High temperature resistance High flow Excellent chemical resistance Low warpage	Excellent mechanical strength Low coefficient of thermal expansion Outstanding dielectric properties Better dimensional stability	High temperature resistance High Strength Good processing and molding properties Thin-walled parts

**2.Medical grade material**
Medical device fixture	Disinfection tray	Surgical instruments

Good processing and molding properties Thin-walled parts Chemical resistance Sterilizability High rigidity and high strength	High Strength High toughness High temperature resistance Sterilizability	Good processing and molding properties Dimensional stability Creep resistance Chemical resistance Sterilizability

3.Industrial supplies
Automotive lighting system	Cooling system	3D printing

Good resistance to high and low temperatures Good processing and molding properties Low gas emission	High machining accuracy High strength, high rigidity and long service life Excellent flame retardancy	High machining accuracy High strength, high rigidity and long service life Excellent flame retardancy

**4.Aerospace materials**
Satellite	Aircraft control panel	Aircraft fuselage

High temperature resistance Radiation resistance Excellent dimensional stability	Low flame retardancy Excellent chemical resistance Good processing and molding properties	High strength-to-weight ratio High temperature resistance

**Typical Application Cases**
USB	TF Card Slot	Type-C	Computer Connector

U-shaped 5.0 Shrapnel Glue Core	FPC Connector	RF Terminal Base	Fan