Película de Polímero de Cristal Líquido (LCP)
HRF-B150
Main App：CCL/FCCL/FPC/FFC
;Diaphragm for headphone; Filter
;Diaphragm for headphone; Filter
Cantidad
Features of Copolymen®(LCP Film)
- Low dielectric dissipation factor.
- Low water absorption, so there is little change in the dielectric properties and dimensions under humid conditions.
- Homogeneous materials, so the dielectric properties are very uniform.
- Good processability.
Key Characteristic Comparison with Competitive Films(*1)
| Water absorption | Transmission loss | Solder heat resistance | Processing | Gas barrier property | ||||
| Room temperature | Under humid condition | Lamination | Drilling | Bending | ||||
JUJIA Copolymen® LCP film | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
| Polyimide film | △ | △ | △ | ○ | △ | ○ | △ | △ |
| Fluorine-based film | ○ | ○ | ○ | ○ | △ | △ | △ | / |
*1: Data for competitive films were taken from their website and other sources.
Jujia can offer engineering plastic films with different thickness along with minuscule dimension change.
JUJIA「Copolymen®」 Items to be Launched
Grade | HT | LM |
Thickness | 25μm | 25μm |
38μm | 38μm | |
50μm | 50μm | |
75μm | 75μm | |
100μm | 100μm | |
300μm | 300μm | |
500μm | 500μm | |
700μm | 700μm |
Note: HT is high heat resistance; LM is low melting point.
Key Items of Copolymen®(LCP Film)
Items | Unit | Method | HT-50 | LM-50 | HT-100 | LM-100 |
Tensile strength | MPa | ASTM D882 | 200 | 210 | 190 | 200 |
Elongation | % | 30 | 35 | 27 | 30 | |
Tensile modulus | MPa | 3600 | 3300 | 3500 | 3200 | |
Melting temperature | ℃ | DSC | 310 | 280 | 310 | 280 |
Coefficient of thermal expansion | ppm/℃ | TMA(10-210℃) | 20 | 20 | 18 | 18 |
Surface resistivity | Ω | IEC62631-3-1/2 | 6E+16 | 5E+16 | 6E+16 | 5E+16 |
Volume resistivity | Ω•cm | 3E+16 | 4E+16 | 2E+16 | 3E+16 | |
Breakdown voltage | kV/mm | IEC60243-1 | 200 | 200 | 200 | 200 |
Moisture absorption | % | ISO 62 | 0.04 | 0.04 | 0.04 | 0.04 |
Dielectric constant (Dk) | － | SPDR(15GHz) | 3.3 | 3.3 | 3.3 | 3.3 |
Dielectric dissipation factor (Df) | － | 0.002 | 0.002 | 0.002 | 0.002 | |
Flammability | － | UL-94 | VTM-0 | VTM-0 | VTM-0 | VTM-0 |
Application Examples of LCP Film
- Multilayer LCP circuit interconnections
- Filters and other circuit devices on LCP films
- Flexible LCP antennas
- System-in-package and antenna-in-package modules
- MEMS
1.Multilayer LCP circuit interconnections
(a) WG-to-SIW transition with linearly tapered antipodal slot line in multilayer LCP substrates in the W-band[1]
(b) Vertical CBCPW-to-SL transition with blind and through vias[2]
(c) Ultra-wideband MSL-to-MSL transitions in different circuit layers in a multilayer LCP substrate[3]
(d) Vialess MSL-to-SL transition in a multilayer LCP substrate in E and W-bands[4] (low dielectric dissipation factor, good processability)
(low dielectric dissipation factor, good processability)
2.Filters and other circuit devices on LCP films
(a) SIW filter with iris windows in a single-layer LCP film at 94 GHz[1]
(b) Compact eight-pole bandpass filter with transmission zero from 2 to 10 GHz in multilayer LCP substrates[2]
(c) Miniaturized balanced bandpass filter with full EM shielding using self-package technologies in multilayer LCP substrates[3]
(d) Slot-coupled traveling-wave directional filters with four ports at 95 GHz in multilayer LCP substrates[4]
(e) Compact broadband balun based on a quasi LC transformer network[5]
(f) Low-profile Rotman-lens-fed beamformer for 5G conformal applications at 28 GHz[6]
(low transmission loss, high frequency and high-speed)
3.Flexible LCP antennas
(a) Folded 3-D cubic antenna: Apply to radio frequency identification devices (RFIDs) and wireless sensor networks (WSNs)[1]
(b) Flexible tapered slot antennas (TSAs): high-gain applications, THz applications[2]
(c) A compact MIMO antenna: automotive communication，flexible communication and implantable applications[3]
(d) Compact tri-band antenna with L-shaped strips on the main radiation patch and the ground plane[4]
(e) Flexible microwave polarizer based on complementary split ring resonators at 10 GHz[5]
(f) Phased patch array antenna with continuous beam steering angles from 31 to 39 GHz[6]
(good flexibility)
(b) Flexible tapered slot antennas (TSAs): high-gain applications, THz applications[2]
(c) A compact MIMO antenna: automotive communication，flexible communication and implantable applications[3]
(d) Compact tri-band antenna with L-shaped strips on the main radiation patch and the ground plane[4]
(e) Flexible microwave polarizer based on complementary split ring resonators at 10 GHz[5]
(f) Phased patch array antenna with continuous beam steering angles from 31 to 39 GHz[6]
(good flexibility)
4.System-in-package and antenna-in-package modules
(a) Packaged double low-noise amplifier module[1] : with V-shaped wire bonding techniques , the integration of wideband indium phosphide (InP) LNA on LCP substrates, achieving low insertion loss up to 110 GHz
(b) Packaged phased array with integrated silicon germanium amplifiers and phase shifters in the X-band[2]
(c) AiP phased-array module with wide bandwidth for 5G mmW communications applications[3]
(d) Front-end multi-chip receiving module for passive mmW imaging, achieving a high gain rate of 63.5 dB and a low noise rate of less than 6 dB at 95 GHz[4]
(low coefficient of thermal expansion)
5.MEMS
(a) spring-like MEMS CPW switch using laser assisted packaging with LCP films[1]
(b) Independently fabricated biomedical modules of the neural stimulator (left) and the implantable test using a rat to characterize the stimulus parameters (right)[2]
(c) Frequency-tunable bandpass filter with integrated microfluidics[3]
(moisture resistance and temperature stability)